| 发明名称 |
APPARATUS AND METHODS RELATED TO COPPER PLATING OF WAFERS |
| 摘要 |
Apparatus and methods related to copper plating of wafers. In some implementations, a method for copper plating a wafer can include estimating a change in surface area exposed on a side of the wafer. The estimated change, such as an increase in surface area, can be based at least in part on a number of vias formed on the side of the wafer. The method can further include adjusting a plating parameter, such as a plating time interval, based on the estimated change. Additionally, a number of processing techniques can be implemented to reduce oxidation of the plated copper. |
| 申请公布号 |
US2015233008(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201514621355 |
申请日期 |
2015.02.12 |
| 申请人 |
SKYWORKS SOLUTIONS, INC. |
发明人 |
RIEGE Jens Albrecht;SANTOS Patrick N. |
| 分类号 |
C25D7/12;C25D17/00;C25D17/06;C25D21/12 |
主分类号 |
C25D7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for copper plating a wafer, the method comprising:
estimating a change in surface area exposed on a side of the wafer, the estimated change based at least in part on a number of vias formed on the side of the wafer; and adjusting a plating parameter based on the estimated change. |
| 地址 |
Woburn MA US |
