| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a coupling noise between signal paths.SOLUTION: A signal transfer through electrode T1 of a first semiconductor chip is arranged adjacently to respective potential supply through electrodes S1 and S2 of the first semiconductor chip. A second signal transfer through electrode T2 of the first semiconductor chip is arranged adjacently to respective potential supply through electrodes S1 and S3 of the first semiconductor chip. A signal transfer through electrode T1 of a second semiconductor chip is arranged adjacently to respective potential supply through electrodes S1 and S2 of the second semiconductor chip. A signal transfer through electrode T2 of the second semiconductor chip is arranged adjacently to the respective potential supply through electrodes S1 and S3 of the second semiconductor chip. The signal transfer through electrode T1 of the first semiconductor chip and the signal transfer through electrode T2 of the second semiconductor chip are electrically connected with each other.</p> |
