WIRING BOARD, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a stacked via structure, in a wiring board having a stacked via structure.SOLUTION: A wiring board has: a first multilayer wiring layer (23, 24) of a stacked via structure having a first electrode pad P1; and a second multilayer wiring layer (23, 24, 25) of a non-stacked via structure having a second electrode pad P2. The second electrode pad P2 is formed on an uppermost first insulating layer 36. The first electrode pad P1 is formed on a second insulating layer 35 located one layer below the first insulating layer 36, and is placed at an opening 36a of the first insulating layer 36 so as to expose an upper surface and a lateral face.