发明名称 FABRICATION OF FIELD-EFFECT TRANSISTORS WITH ATOMIC LAYER DOPING
摘要 Field effect transistors fabricated using atomic layer doping processes are disclosed. In accordance with an embodiment of an atomic layer doping method, a semiconducting surface and a dopant gas mixture are prepared. Further, a dopant layer is grown on the semiconducting surface by applying the dopant gas mixture to the semiconducting surface under a pressure that is less than 500 Torr and a temperature that is between 300° C. and 750° C. The dopant layer includes at least 4×1020 active dopant atoms per cm3 that react with atoms on the semiconducting surface such that the reacted atoms increase the conductivity of the semiconducting surface.
申请公布号 US2015236118(A1) 申请公布日期 2015.08.20
申请号 US201514699859 申请日期 2015.04.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHAN KEVIN K.;KIM YOUNG-HEE;LAUER ISAAC;MURALIDHAR RAMACHANDRAN;PARK DAE-GYU;WANG XINHUI;YANG MIN
分类号 H01L29/66;H01L29/45;H01L29/78;H01L29/08;H01L21/225;H01L21/324 主分类号 H01L29/66
代理机构 代理人
主权项 1. An atomic layer doping method comprising: preparing a semiconducting surface; preparing a dopant gas mixture; and growing a dopant layer on the semiconducting surface by applying the dopant gas mixture to the semiconducting surface under a pressure that is less than 500 Torr and a temperature that is between 300° C. and 750° C., wherein the dopant layer includes at least 4×1020 active dopant atoms per cm3 that react with atoms on the semiconducting surface such that the reacted atoms increase the conductivity of the semiconducting surface.
地址 ARMONK NY US