| 发明名称 |
SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME |
| 摘要 |
An embodiment device package includes first die and one or more redistribution layers (RDLs) electrically connected to the first die. The one or more RDLs extend laterally past edges of the first die. The device package further includes one or more second dies bonded to a first surface of the one or more RDLs and a connector element on the first surface of the one or more RDLs. The connector element has a vertical dimension greater than the one or more second dies. A package substrate is bonded to the one or more RDLs using the connector element, wherein the one or more second dies is disposed between the first die and the package substrate. |
| 申请公布号 |
US2015235989(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201414473236 |
申请日期 |
2014.08.29 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Lii Mirng-Ji;Lee Chien-Hsun;Wang Tsung-Ding;Cheng Jung Wei;Liu Ming-Che;Hou Hao-Cheng;Lin Hung-Jen |
| 分类号 |
H01L25/065;H01L23/367;H01L25/00;H01L23/498;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device package comprising:
a first die; one or more redistribution layers (RDLs) electrically connected to the first die, wherein the one or more RDLs extend laterally past edges of the first die; one or more second dies bonded to a first surface of the one or more RDLs; a connector element on the first surface of the one or more RDLs, wherein the connector element has a vertical dimension greater than the one or more second dies; and a package substrate bonded to the one or more RDLs using the connector element, wherein the one or more second dies is disposed between the first die and the package substrate. |
| 地址 |
Hsin-Chu TW |
