发明名称 METHOD OF MANUFACTURING LIGHT SOURCE MODULE AND METHOD OF MANUFACTURING LIGHTING DEVICE
摘要 There is provided a method of manufacturing a light source module including: preparing a board including circuit wirings and a lens having an accommodation groove formed in a bottom surface thereof; attaching a buffer film to a bottom surface of the accommodation groove of the lens; mounting and arranging a plurality of light emitting devices on one surface of the board such that the plurality of light emitting devices are electrically connected to the circuit wirings; mounting the lens on the board such that the plurality of light emitting devices are accommodated within the accommodation groove in a state in which the buffer film faces the plurality of light emitting devices; and attaching the lens to the board such that the buffer film is tightly attached to upper surfaces of the plurality of light emitting devices and the bottom surface of the accommodation groove.
申请公布号 US2015233551(A1) 申请公布日期 2015.08.20
申请号 US201414507544 申请日期 2014.10.06
申请人 CHO Hyoung Cheol;KIM Tae Gyu;CHUNG Tai Oh;HAN Min Soo 发明人 CHO Hyoung Cheol;KIM Tae Gyu;CHUNG Tai Oh;HAN Min Soo
分类号 F21V15/01;H01L25/075;H01L33/62;H01L33/48;F21V19/00;H05K13/04 主分类号 F21V15/01
代理机构 代理人
主权项 1. A method of manufacturing a light source module, the method comprising: preparing a board including circuit wirings and a lens having an accommodation groove formed in a bottom surface thereof to be in contact with the board; attaching a buffer film to a bottom surface of the accommodation groove of the lens; mounting and arranging a plurality of light emitting devices on one surface of the board such that the plurality of light emitting devices are electrically connected to the circuit wirings; mounting the lens on the board such that the plurality of light emitting devices are accommodated within the accommodation groove in a state in which the buffer film faces the plurality of light emitting devices; and attaching the lens to the board through thermo-compression such that the buffer film is tightly attached to upper surfaces of the plurality of light emitting devices and the bottom surface of the accommodation groove.
地址 Seoul KR