| 摘要 |
According to some embodiments of the invention, a light-emitting device package includes a body including top and bottom surfaces and a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor. The light-emitting device package also includes a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity. A socket is formed over the plurality of LED dies. The socket includes a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket. A lens is disposed over the over the socket. The lens includes two or more optical materials with different indices of refraction. The lens includes a cap and a plug. The cap has an upper surface and a lower surface, and the plug has a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap. |
| 主权项 |
1. A light-emitting device package comprising:
a body including top and bottom surfaces; a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor; one or more LED (light-emitting-diode) dies disposed on the floor of the cavity; an encapsulation layer disposed within the cavity over the one or more LED dies; a socket formed over the encapsulation layer, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket; a lens disposed over the over the socket, the lens comprising two or more optical materials with different indices of refraction, the lens including a cap and a plug, the cap having an upper surface and a lower surface, the plug having a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket; and an adhesive layer disposed to attach the lower surface of the cap to the top surface of the socket, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug. |
