发明名称 |
FORMING A CASING OF AN ELECTRONICS DEVICE |
摘要 |
A method of forming a casing of an electronic device is described in which heat and pressure are applied to a metal substrate and a metal layer in a molding device. The metal substrate and the metal layer are molded into a shape of the casing. At the same time, an intermediate phase between the metal substrate and the metal layer is formed by inter-diffusion bonding. |
申请公布号 |
WO2015122882(A1) |
申请公布日期 |
2015.08.20 |
申请号 |
WO2014US15993 |
申请日期 |
2014.02.12 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
WU, KUAN-TING;KANG, YU-CHUAN |
分类号 |
B23K20/02;B21D22/04;B21D37/16;B23K20/16 |
主分类号 |
B23K20/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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