THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS

摘要

Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

主权项

1. An integrated circuit, comprising:
a resistor; a metal region disposed parallel to and overlapping at least part of the resistor; and one or more thermal posts electrically connected to the metal region and disposed between the metal region and the resistor, the thermal posts electrically isolated from the resistor.