ELECTRONIC DEVICE WITH HEAT DISSIPATER

摘要

An electronic device includes an integrated circuit chip mounted to a heat slug. The heat slug has a peripheral region having first thickness along a first direction, the peripheral region surrounding a recess region (having a second, smaller, thickness along the first direction) that defines a chip mounting surface along a second direction perpendicular to the first direction. The recess region defines side borders and a nook extends into the heat slug along the side borders. An insulating body embeds the integrated circuit one chip and heat slug. Material of the insulating body fills the nook.

主权项

1. An electronic device, comprising:
at least one chip wherein at least one electronic component is integrated; an insulating body embedding said at least one chip, the insulating body having a mounting surface configured to mount the electronic device on a board; a heat slug in contact with said at least one chip and configured to dissipate heat generated by said at least one electronic component toward the mounting surface, the heat slug having a first thickness along a first direction perpendicular to the mounting surface, the heat slug being embedded in said insulating body with a bottom surface exposed from the insulating body at the mounting surface, wherein: the heat slug is provided with a recess that defines a recessed portion of the heat slug having a second thickness along the first direction smaller than the first thickness; said recess having a main surface, perpendicular to the first direction and opposed to the bottom surface, and side borders; said at least one chip is in contact with the main surface of the recess; said recess comprising nooks extending inward the heat slug from said side borders.