| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which sufficiently suppresses warpage while keeping high insulation reliability and is also excellent in flexibility, when a protection film of a flexible wiring board is formed.SOLUTION: There is provided a thermosetting resin composition which contains a polyurethane resin that contains a constitutional unit derived from alicyclic diol and has an acid value of 10-35 mgKOH/g, a curing agent and an organic solvent. |
