| 摘要 |
PROBLEM TO BE SOLVED: To prevent deformation or short circuit of a flying lead due to the dummy pattern of a metal foil, when immersing a flexible printed wiring board material subjected to etching into peeling liquid, and dissolving and removing the resist.SOLUTION: A method of manufacturing a flexible printed wiring board includes a base material formation step for forming a flexible printed wiring board base material provided with a flying lead and a dummy pattern 55 above a device hole 57, and a separation step for separating the dummy pattern 55 from the flexible printed wiring board base material, by immersing the flexible printed wiring board base material into a resist peeling liquid, and dissolving an etching resist and a rear-fixing resist. The dummy pattern 55 includes a continuous peripheral edge 55a, and a division part 55b for dividing the inside area, surrounded by the peripheral edge 55a, so as to form a plurality of openings 55c therein. |
