| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductor paste for low temperature firing capable of forming a conductor film of which a resin is sufficiently fired even by firing at low temperatures of 500°C or lower, and conductivity and adhesiveness are excellent.SOLUTION: Such a conductor paste (copper paste) contains copper powder, a glass frit, a thermoplastic resin, and a solvent. The thermoplastic resin has such properties as to be fired in an inert gas atmosphere at temperatures of 500°C or lower, and is contained at a ratio of 0.1-1 mass% when the whole conductor paste is set at 100 mass%. The solvent contains a high-viscosity organic solvent having viscosity at 20°C of 200-2,000 mPa s.</p> |
