| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a semiconductor sealing material excellent in heat resistance, and to provide a semiconductor device excellent in reliability obtained by sealing a semiconductor element with a cured product of the resin composition.SOLUTION: The resin composition of the present invention contains a maleimide compound represented by general formula (1), an allyl compound having three or more allyl groups, an amine compound, and a curing catalyst. The resin composition preferably contains an epoxy resin. Further, the resin composition preferably contains an imidazole compound. The allyl compound is preferably a compound represented by formula (2).</p> |
