| 发明名称 |
BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS |
| 摘要 |
A bottom package substrate is provided that includes a plurality of metal posts that electrically couple through a die-side redistribution layer to a plurality of die interconnects. The metal posts and the die interconnects are plated onto a seed layer on the bottom package substrate. |
| 申请公布号 |
US2015235991(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201414254494 |
申请日期 |
2014.04.16 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
Gu Shiqun;Radojcic Ratibor;Kim Dong Wook |
| 分类号 |
H01L25/065;H05K1/11;H01L23/00;H05K1/09;H01L23/31;H01L23/522 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package, comprising:
a substrate; a die-side redistribution layer; a seed layer on the die-side redistribution layer; a plurality of die interconnects electrically coupled to the die-side redistribution layer through the seed layer; and a plurality of metal posts electrically coupled to the die-side redistribution layer through the seed layer. |
| 地址 |
San Diego CA US |
