| 发明名称 |
Sensor and Method for Manufacturing a Sensor |
| 摘要 |
A sensor includes: a substrate, a microelectromechanical structure, and a decoupling structure. The decoupling structure is anchored on the substrate, and the microelectromechanical structure is anchored on the decoupling structure. The microelectromechanical structure and the decoupling structure are movable in relation to the substrate. The decoupling structure is situated between the microelectromechanical structure and the substrate. |
| 申请公布号 |
US2015232327(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201514609737 |
申请日期 |
2015.01.30 |
| 申请人 |
Robert Bosch GmbH |
发明人 |
REINMUTH Jochen |
| 分类号 |
B81B7/00;B81B5/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sensor, comprising:
a substrate; a microelectromechanical structure; and a decoupling structure anchored on the substrate; wherein the microelectromechanical structure is anchored on the decoupling structure, and wherein the microelectromechanical structure and the decoupling structure are movable in relation to the substrate, and wherein the decoupling structure is situated between the microelectromechanical structure and the substrate. |
| 地址 |
Stuttgart DE |
