APPARATUS FOR MEASURING JOINING STRENGTH

摘要

An apparatus for measuring bonding strength is disclosed. According to an embodiment of the present invention, the apparatus for measuring bonding strength comprises: a jig which comes in contact with a substrate and accommodates a specimen connected to the substrate therein; a pump providing a suction force to the jig through a connection pipe; and a measurement unit measuring bonding strength of the specimen with a suction force of the pump.