| 发明名称 |
POLISHING AGENT, POLISHING AGENT SET AND METHOD FOR POLISHING BASE |
| 摘要 |
A polishing agent according to one embodiment of the present invention contains a liquid medium, an abrasive grain including a hydroxide of a tetravalent metal element, a polymer compound having an aromatic ring and a polyoxyalkylene chain, and a cationic polymer, wherein a weight average molecular weight of the polymer compound is 1000 or more. |
| 申请公布号 |
US2015232704(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201314424970 |
申请日期 |
2013.07.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Akutsu Toshiaki;Minami Hisataka;Iwano Tomohiro;Fujisaki Koji |
| 分类号 |
C09G1/02 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing agent, containing:
a liquid medium; an abrasive grain including a hydroxide of a tetravalent metal element; a polymer compound having an aromatic ring and a polyoxyalkylene chain; and a cationic polymer, wherein a weight average molecular weight of the polymer compound is 1000 or more. |
| 地址 |
Tokyo JP |
