SEMICONDUCTOR CHIP, DEFINITION METHOD AND DESIGN METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for defining a dynamic array section to be manufactured on a semiconductor chip.SOLUTION: A method comprises: defining a peripheral boundary of the dynamic array section 3101; defining a manufacturing assurance halo outside the boundary of the dynamic array section 3103; and controlling chip layout features within the manufacturing assurance halo to ensure that manufacturing of conductive features inside the boundary of the dynamic array section is not adversely affected by the chip layout features within the manufacturing assurance halo 3105.