| 摘要 |
A method of production of a circuit board comprising a step of forming resist patterns 20 on a support 10 by a photoresist to obtain a support with resist patterns, a step of forming a curable resin composition layer 30 which is comprised of a curable resin composition on the resist patterns 20 of the support with resist patterns, a step of laying a substrate 40 on the curable resin composition layer 30, a step of making the curable resin composition which forms the curable resin composition layer 30 cure to make the curable resin composition layer 30 a cured resin layer 30a, a step of peeling off the support 10 from the curable resin composition layer 30 or the cured resin layer 30a and the resist patterns 20 before or after making the curable resin composition cure, a step of peeling off or dissolving the resist patterns 20 to remove the resist patterns 20 from the cured resin layer 30a so as to form a cured resin layer which has relief structures, and a step of forming fine wirings 50 by plating recesses of the relief structures which are formed at the cured resin layer 30a. |
