WAFER-LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME

摘要

A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

主权项

1. A method for fabricating an optical subassembly comprising:
fabricating a top layer silicon wafer, the top layer silicon wafer comprising a plurality of individual units of a top layer; fabricating a base layer silicon wafer, the base layer silicon wafer comprising a plurality of individual units of a base layer; aligning and bonding the top layer silicon wafer and the base layer silicon wafer thereby forming a first wafer assembly; assembling a plurality of active optoelectronic elements onto the first wafer assembly; fabricating a glass wafer; aligning and bonding the glass wafer to the first wafer assembly thereby forming a second wafer assembly; and dicing the second wafer assembly into individual optical subassemblies; wherein: the step of fabricating the top layer silicon wafer comprises etching a primary cavity and a plurality of peripheral cavities on each individual unit of the top layer; and the active optoelectronic elements are assembled within the primary cavities of the first wafer assembly.