| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
According to one embodiment, a method of manufacturing a semiconductor device, includes preparing a semiconductor substrate includes a connection pad to electrically connect to a circuit element formed on a main surface, or a rewiring line connected to the connection pad, forming an insulating photosensitive resin film on the substrate with the exclusion of at least an edge portion of the substrate by inkjet, patterning the photosensitive resin film by photolithography, and forming a rewiring line, UBM or an electrode for external connection on the substrate on which the patterned photosensitive resin film is formed. |
| 申请公布号 |
US2015235845(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201514625411 |
申请日期 |
2015.02.18 |
| 申请人 |
TERA PROBE, INC. |
发明人 |
SEKITA Nobuatsu;MIYAMOTO Tsutomu;KANEKO Norihiko;KONO Ichiro |
| 分类号 |
H01L21/02;H01L21/768;H01L21/027;H01L21/3105;H01L21/311;H01L23/00 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor device, comprising:
preparing a semiconductor substrate comprising a connection pad to electrically connect to a circuit element formed on a main surface, or a rewiring line connected to the connection pad, forming an insulating photosensitive resin film on the substrate with an exclusion of at least an edge portion of the substrate by inkjet; patterning the photosensitive resin film by photolithography; and forming a rewiring line, UBM or an electrode for external connection on the substrate on which the patterned photosensitive resin film is formed. |
| 地址 |
Yokohama JP |
