| 摘要 |
It is an object of the present invention to provide a curable resin composition that forms a cured product having both high heat resistance and toughness.;The curable resin composition of the present invention is a curable resin composition comprising a radical polymerizable compound (A), an alicyclic epoxy compound (B), and an acid anhydride (C), or a curable resin composition comprising a radical polymerizable compound (A), an alicyclic epoxy compound (B), and a cationic curing agent (D). These curable resin compositions preferably comprise, as the alicyclic epoxy compound (B), a compound represented by the following formula (b1):;;wherein X represents a single bond or a linking group (a divalent group comprising one or more atoms). |
