发明名称 |
RESIN COMPOSITION, METHOD OF PRODUCING CURED FILM USING RESIN COMPOSITION AND ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which has excellent patterning properties and can suppress the discoloration of a substrate.SOLUTION: A resin composition comprises the following (a) component and (b) component. The (a) component is one or more compound selected from polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, novolac resin and polyhydroxystyrene resin; and the (b) component is a secondary thiol compound represented by the formula (1) (where R is an organic group, and n is an integer of 1-4). |
申请公布号 |
JP2015147907(A) |
申请公布日期 |
2015.08.20 |
申请号 |
JP20140022830 |
申请日期 |
2014.02.07 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
ONO TAKASHI;TANIMOTO AKITOSHI;OE TADAYUKI;SUZUKI KEIKO;SOEJIMA KAZUYA;TAKAHASHI HIROKO |
分类号 |
C08L101/00;C08K5/33;C08K5/37;C08L79/04;G03F7/004;G03F7/027;G03F7/031;H01L21/027 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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