发明名称 HEATED PLATEN WITH IMPROVED TEMPERATURE UNIFORMITY
摘要 A heated platen with improved temperature uniformity is generally described. Various examples provide a platen portion with a metallization layer thermally coupled thereto. An electrical contact may be connected to the metallization layer and configured to conduct an electric current for heating the metallization layer and the platen portion. The electrical contact may include an electrical conductor and a resistive heating element that is configured to heat up when electric current flows therethrough, thereby creating a thermal block that reduces an amount of heat that is absorbed into the electrical contact from the platen portion.
申请公布号 US2015237677(A1) 申请公布日期 2015.08.20
申请号 US201414180962 申请日期 2014.02.14
申请人 Varian Semiconductor Equipment Associates, Inc. 发明人 Fish Roger B.;Anella Steven
分类号 H05B1/02;H05B3/26;H05B3/03 主分类号 H05B1/02
代理机构 代理人
主权项 1. A heated platen, comprising: a platen portion; a metallization layer associated with the platen portion, the metallization layer for selectively heating the platen portion; and an electrical contact coupled to the metallization layer for conducting electricity to the metallization layer, the electrical contact comprising: an electrical conductor; anda resistive heating element, the resistive heating element sized and configured to increase a temperature of a portion of the electrical conductor when electricity flows through the resistive heating element, thereby minimizing heat absorbed by the electrical contact from at least one of the metallization layer and the platen portion.
地址 Gloucester MA US