TOUCH PANEL AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of a touch panel is provided. The method comprises the following procedures: forming a sensing electrode layer on a cover plate, wherein the sensing electrode layer comprises a plurality of first axis electrodes, a plurality of second axis electrodes, a plurality of bonding pads and a plurality of first periphery traces; forming a insulating layer on the sensing electrode layer, wherein a plurality of first via holes and a plurality of second via holes are formed on the insulating layer; forming a jumper layer on the insulating layer, wherein the jumper layer comprises a plurality of jumper traces and a plurality of second periphery traces. Moreover, the sensing electrode layer, the insulating layer and the jumper layer are formed through a printing process, a photo etching process, a spraying process, a slit coating process, a laser scribing process, a laminating process or any combination thereof.

主权项

1. A manufacturing method of a touch panel, comprising the following steps:
forming a sensing electrode layer on a cover plate, wherein the sensing electrode layer comprises: a plurality of first axis electrodes, with each first axis electrode comprising a plurality of first electrode blocks arranged along a first direction, wherein the first electrode blocks are electrically connected to each other; a plurality of second axis electrodes, with each second axis electrode comprising a plurality of second electrode blocks arranged along a second direction, wherein the second electrode blocks are electrically isolated from each other; a plurality of bonding pads, disposed on the periphery of the cover plate; and a plurality of first periphery traces that are electrically connected to the bonding pads and the first axis electrodes or the second axis electrodes respectively; forming a insulating layer on the sensing electrode layer, wherein a plurality of first via holes and a plurality of second via holes are formed on the insulating layer, wherein each first via hole exposes the first axis electrodes or the second axis electrodes that are not electrically connected to the first periphery traces, and each second via hole exposes parts of the second electrode blocks of the second axis electrodes; and forming a jumper layer on the insulating layer, wherein the jumper layer comprises a plurality of jumper traces and a plurality of second periphery traces, wherein the second periphery traces are electrically connected to the first axis electrodes or the second axis electrodes through the first via holes, and the jumper traces are electrically connected to the second electrode blocks of the second axis electrodes through the second via holes, wherein the first axis electrodes or the second axis electrodes are not electrically connected to the first periphery traces; wherein the sensing electrode layer, the insulating layer and the jumper layer are formed by a printing, process, a photo etching process, a spraying process, a slit coating process, a laser scribing process, a laminating process or any combination thereof.