Real Time Semiconductor Process Excursion Monitor

摘要

Semiconductor process excursions may be monitored by fabricating functional circuitry on a plurality of semiconductor devices and then testing the functional circuitry of the plurality of semiconductor devices using a sequence of test patterns. A cumulative failure curve may be determined that has points of discontinuity based on results of testing with the sequence of test patterns. A point of discontinuity magnitude at a selected location in the cumulative failure curve may be compared to an expected discontinuity magnitude. Process excursion analysis may be indicated when a point of discontinuity magnitude exceeds an expected magnitude threshold.

主权项

1. A method for monitoring process excursions, the method comprising:
fabricating functional circuitry on a plurality of semiconductor devices; testing the functional circuitry of the plurality of semiconductor devices using a sequence of test stimuli; determining a cumulative failure curve having points of discontinuity based on results of testing with the sequence of test stimuli; comparing a point of discontinuity magnitude at a selected location in the cumulative failure curve to an expected discontinuity magnitude; and indicating that process excursion analysis should be done for the plurality of semiconductor devices when the point of discontinuity magnitude exceeds an expected magnitude threshold.