| 发明名称 |
THERMALLY CONDUCTIVE POROUS MEDIA |
| 摘要 |
The present invention relates to compositions comprising a thermally conductive porous media, optionally linked to a heat spreading interfacial material. These compositions provide heat dissipation from a heat source. These compositions can be used in a variety of applications including effective removal of heat from electronic and other enclosed devices. |
| 申请公布号 |
US2015232732(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201214344212 |
申请日期 |
2012.09.14 |
| 申请人 |
DiBattista Gerald A.;Mace Tamara Lee;Wingo James P.;Mao Guoqiang |
发明人 |
DiBattista Gerald A.;Mace Tamara Lee;Wingo James P.;Mao Guoqiang |
| 分类号 |
C09K5/14;F21V29/15;F21V3/04 |
主分类号 |
C09K5/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermally conductive porous plastic composition comprising:
a plastic; and, a conductive filler, wherein the thermally conductive porous plastic composition has an in-plane thermal conductivity greater than 0.5W/mK. |
| 地址 |
Peachtree City GA US |
