| 摘要 |
An MEMS package and the manufacturing method thereof are disclosed. The MEMS package includes a package substrate, a block ring, an MEMS chip and an encapsulating material. The package substrate has an inner surface, a corresponding outer surface and a signal opening that penetrates the inner surface and outer surface. The package substrate further has at least one inner contact pad and at least one outer contact pad wherein the outer contact pad is disposed on the outer surface. The inner contact pad is electrically coupled to the outer contact pad. The block ring is disposed on the inner surface and surrounds the signal opening. The MEMS chip has an active surface, at least one sensor device and at least one chip contact pad, wherein the sensor device and the chip contact pad are disposed on the active surface. The active surface is attached to the block ring so that the sensor device is surrounded by the block ring. The chip contact pad is electrically coupled to the inner contact pad. The encapsulating material covers the MEMS chip, the outer side of the block ring and the inner contact pad. |
| 主权项 |
1. An MEMS package comprising:
a package substrate, having an inner surface, a corresponding outer surface, at least one wire opening and a signal opening penetrating the inner surface and the outer surface, at least one inner contact pad disposed on a periphery of the wire opening and between the inner surface and the outer surface, at least one outer contact pad disposed on the outer surface, the inner contact pad electrically coupled to the outer contact pad; a block ring, disposed on the inner surface and surrounding the signal opening; an MEMS chip, having an active surface, the active surface having at least one sensor device and at least one chip contact pad, the active surface attached to the block ring so that the sensor device is surrounded by the block ring, the chip contact pad electrically coupled to the inner contact pad by a wire through the wire opening; and an encapsulating material, covering the MEMS chip, the outer side of the block ring and the wire opening. |
