| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module capable of preventing a sealing resin body from peeling off from a lead.SOLUTION: A semiconductor module (10) comprises a semiconductor device (12) and a relay member (14). The semiconductor device (12) comprises an electronic component (20), a sealing resin body (42) sealing the electronic component, and a lead (36) having an inner lead portion (36a) disposed in the sealing resin body and electrically connected to the electronic component, and an outer lead portion (36b) extending from the inner lead portion and is disposed outside the sealing resin body. The relay member (14) is electrically connected to the outer lead portion in order to electrically relay a connection target of the semiconductor device and the electronic component. The relay member has flexibility. |
