发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
A method of manufacturing a semiconductor device, includes the steps of passing a control terminal through an opening of a resin case to partially expose the control terminal and covering a patterned insulating substrate with the resin case; inserting a resin block in the opening of the resin case; fitting a convex step portion formed on a side surface of the resin block into a valley formed between two projections of the control terminal; fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case; and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal. |
申请公布号 |
US2015235965(A1) |
申请公布日期 |
2015.08.20 |
申请号 |
US201514703313 |
申请日期 |
2015.05.04 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
KODAIRA Yoshihiro |
分类号 |
H01L23/544;H01L21/56;H01L23/14;H01L23/29;H01L23/31;H01L29/66 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a semiconductor device including a control terminal attached to a patterned insulating substrate, and a resin case disposed to cover the patterned insulating substrate and having an opening for passing the control terminal therethrough, the method comprising the steps of:
passing the control terminal through the opening of the resin case to partially expose the control terminal from the opening and covering the patterned insulating substrate with the resin case; and inserting a resin block in the opening of the resin case, fitting a convex step portion formed on a side surface of the resin block into a concave formed between two projections of the control terminal, fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case, and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal. |
地址 |
Kawasaki-shi JP |