发明名称 Thread Optimized Multiprocessor Architecture
摘要 In one aspect, the invention comprises a thread optimized multiprocessor prepared by a semiconductor manufacturing process, comprising the steps of: (a) interconnecting less than 4 layers of metal on at least one die; (b) embedding at least one processor in said at least one die; and (c) mounting said at least one die on a dual inline memory module.
申请公布号 US2015234777(A1) 申请公布日期 2015.08.20
申请号 US201414553262 申请日期 2014.11.25
申请人 Fish, III Russell H. 发明人 Fish, III Russell H.
分类号 G06F15/80;G06F13/28 主分类号 G06F15/80
代理机构 代理人
主权项 1. A thread optimized multiprocessor prepared by a semiconductor manufacturing process, comprising the steps of: (a) interconnecting less than 16 layers of metal on at least one die; (b) embedding at least one processor in said at least one die; and (c) mounting said at least one die on a dual inline memory module.
地址 Dallas TX US