| 发明名称 |
SOLDERING METHOD FOR POLYMER THICK FILM COMPOSITIONS |
| 摘要 |
A method of soldering to a polymer thick film material, comprising the steps of providing a substrate having a polymer thick film layer on at least one surface of the substrate, incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed, curing the polymer thick film layer to secure the metal preform thereto, and soldering to the exposed surface of the metal preform using a solder material. |
| 申请公布号 |
US2015231740(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201514616935 |
申请日期 |
2015.02.09 |
| 申请人 |
Heraeus Precious Metals North America Conshohocken LLC |
发明人 |
Grabey Steven;Groman Sarah;Persons Ryan;Shahbazi Samson |
| 分类号 |
B23K31/02;B32B15/08;B23K35/30;B23K35/28;B32B37/24;B23K35/26 |
主分类号 |
B23K31/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of soldering to a polymer thick film material, comprising the steps of:
providing a substrate having a polymer thick film layer on at least one surface of the substrate; incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed; curing the polymer thick film layer to secure the metal preform thereto; and soldering to the exposed surface of the metal preform using a solder material. |
| 地址 |
West Conshohocken PA US |
