发明名称 INTEGRATED VOLTAGE REGULATOR WITH EMBEDDED PASSIVE DEVICE(S) FOR A STACKED IC
摘要 A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on.
申请公布号 US2015235952(A1) 申请公布日期 2015.08.20
申请号 US201514703240 申请日期 2015.05.04
申请人 QUALCOMM Incorporated 发明人 Pan Yuancheng Christopher;Sweeney Fifin;Chua-Eoan Lew G.;Zhu Zhi;Zhang Junmou
分类号 H01L23/538;H05K1/16;H05K1/18;H05K1/11;H01L23/00;H01L25/065 主分类号 H01L23/538
代理机构 代理人
主权项 1. A stacked integrated circuit, comprising: a first semiconductor IC having a first active face, and a first interconnect structure; a second semiconductor IC stacked on the first semiconductor IC having a second active face disposed opposite the first active face and a second interconnect structure coupled to the first interconnect structure; the second active face receiving a regulated voltage from a voltage regulator; and an active portion of the voltage regulator in the first semiconductor IC coupled to the first interconnect structure supplying regulated voltage to the first and second semiconductor ICs.
地址 San Diego CA US