发明名称 |
METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS |
摘要 |
A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate. |
申请公布号 |
US2015231758(A1) |
申请公布日期 |
2015.08.20 |
申请号 |
US201414184286 |
申请日期 |
2014.02.19 |
申请人 |
Rohm and Haas Electronic Materials CMP Holdings, Inc. |
发明人 |
McClain George;Saikin Alan;Kolesar David;Sarafinas Aaron;Post Robert L. |
分类号 |
B24B37/24;B24D3/32;B24D18/00 |
主分类号 |
B24B37/24 |
代理机构 |
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代理人 |
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主权项 |
1. A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate, comprising:
providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period of >3 hours to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate. |
地址 |
Newark DE US |