| 摘要 |
This wire bonding apparatus is provided with: a bonding tool (40) having a wire (42) inserted therein; a control unit (80) that moves the bonding tool (40) for the purpose of cutting the wire (42) after forming a wire loop (90) between a first bond point and a second bond point of a subject (100) to which the wire is to be bonded; and a monitor unit (70), which supplies a predetermined electric signal between the subject (100) and the wire (42) inserted in the bonding tool (40), and which monitors whether the wire (42) is cut or not on the basis of an output of the electric signal thus supplied. The control unit (80) is configured to continue, on the basis of monitoring results obtained from the monitor unit (70), moving the bonding tool (40) during a period when it is determined that the wire (42) is not cut, and to stop moving the bonding tool (40) when it is determined that the wire (42) is cut. Consequently, wire bonding operation time can be shortened, and processing efficiency can be improved. |
