发明名称 発光素子搭載用配線基板
摘要 To provide a light emitting element mounting wiring substrate having a light emitting element mounting section on a substrate main body having a front surface and a back surface, and a confined component electrically connected to the light emitting element, such that the confine component does not obstruct the optical path of the light emitted from the light emitting element, resulting in uniform distribution of light intensity. The light emitting element mounting wiring substrate (1a) includes a substrate main body (2) which has a front surface (3) and a back surface (4) and which includes at least an insulating substrate (2a), and a plurality of element terminals (13, 14) formed on the front surface (3) of the substrate main body (2), at least one of the element terminals having a light emitting element mounting section (fa) on the top surface thereof, wherein the wiring substrate has a Zener diode (confined element) (10) embedded in the substrate main body (2), which element is electrically connected to a light emitting element (20) mounted on the mounting section (fa) and prevents application of overvoltage to the light emitting element (20).
申请公布号 JP5766593(B2) 申请公布日期 2015.08.19
申请号 JP20110270036 申请日期 2011.12.09
申请人 发明人
分类号 H01L33/62;H05K3/00;H05K3/46 主分类号 H01L33/62
代理机构 代理人
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