| 摘要 |
An electroplating process and apparatus (1a, 1b), particularly for plating or forming parts made of electrically conducting materials. More precisely, the apparatus (1a, 1b) comprises a tank (3), intended to contain a galvanic bath (4) that contains an aqueous solution of the salt of the metal to be deposited, or of the salts of the metals forming the metal alloy to be deposited, and a supporting frame (5), intended to support the parts to be plated (6) and to be connected electrically to the negative pole of at least one power supply (7), the parts to be plated (6) being immersible in the galvanic bath (4). The particularity of the invention resides in the fact that it comprises a plurality of electrodes (15a, 15b) that can be immersed in the galvanic bath (4) and are connected electrically to a plurality of positive poles of the power supply (7), so as to form a plurality of anodes that are supplied with direct current and independently of each other to generate a flow of a plurality of electric currents, between the electrodes (15a, 15b) and the parts to be plated (6), which is controlled and balanced, with a consequent homogeneity of the thickness of the layer of deposited metal and/or of the titer of the alloy deposited by galvanic effect on the parts to be plated (6). |
