发明名称 |
Amplifier circuit |
摘要 |
<p>An integrated power amplifier circuit is disclosed. The circuit comprises: first and second amplifiers fabricated on one or more dies, the one or more dies being mounted on a support structure; a first set of one or more connection elements connected to the first amplifier and passing above a portion of the support structure; and a second set of one or more connection elements connected to the second amplifier and passing above a portion of the support structure. The support structure comprises at least one void, at least a portion of the at least one void being positioned directly underneath at least one of the first and second sets of one or more connection elements.</p> |
申请公布号 |
EP2733742(B1) |
申请公布日期 |
2015.08.19 |
申请号 |
EP20120192808 |
申请日期 |
2012.11.15 |
申请人 |
NXP B.V. |
发明人 |
CUOCO, VITTORIO;VAN DER ZANDEN, JOS;VAN ZUIJLEN, ALBERT |
分类号 |
H01L21/50;H01L23/00;H01L23/66;H03F1/02;H03F3/68 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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