METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS
摘要
<p>The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.</p>
申请公布号
EP2823084(B1)
申请公布日期
2015.08.19
申请号
EP20130710864
申请日期
2013.03.21
申请人
ATOTECH DEUTSCHLAND GMBH
发明人
TEWS, DIRK;MICHALIK, FABIAN;GIL IBÀNEZ, BELEN;BRANDT, LUTZ;HSIEH, MENG CHE;ZHIMING, LIU
