| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device, in which a flip-chip type light emitting element is mounted on a substrate at good heat conducting efficiency. <P>SOLUTION: Plural sets 30a of first pads 31a and second pads 32a are arranged in line, and a coupling part 33a is arranged between the second pad 32a and a first pad 31b of an adjacent set 30b. Solder 4 is supplied on the first pads, respectively. Light emitting elements 1a-1d are mounted on sets 30a-30d of the first pads and the second pads. A substrate 2 is heated to a predetermined temperature, and the solder 4 is molten and made wet and spread on the first pads. Furthermore, the solder is made wet and spread on the second pads 32a via the coupling part 33a and the like. The solder is cooled to form a solder layer 40, and is jointed with the light emitting element. <P>COPYRIGHT: (C)2013,JPO&INPIT |
