| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which prevents the deterioration of the joining strength between an electrode pad of an integrated circuit element and a solder bump. <P>SOLUTION: A piezoelectric device 100 of this invention includes: an element mounting member 110; a piezoelectric element 120 mounted on the element mounting member 110; metal patterns 118, each of which is formed on a surface of the element mounting member 110 and includes an element mounting region 118a and a routing region 118b; and an integrated circuit element 130 electrically connecting with the element mounting region 118a of each metal pattern 118 by a solder bump 132. Each metal pattern 118 has a protruding part 119 provided between the element mounting region 118a and the routing region 118b, and at least a surface part of the protruding part 119 is formed by a metal oxide. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
