| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an episulfide resin material excellent in moisture resistance and electrical properties of the cured product, and a multilayer board using the episulfide resin material. <P>SOLUTION: The episulfide resin material include: an episulfide resin; a curing agent; and an inorganic filler. The curing agent is an active ester compound or a cyanate ester compound. The multilayer board 11 includes: a circuit board 12; and cured material layers 13-16 arranged on a surface 12a in which a circuit of the circuit board 12 is formed. The cured material layers 13-16 are formed by curing the episulfide resin material. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
