发明名称 |
Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution |
摘要 |
Provided is a method of producing a polyimide resin that produces a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature. The method of producing a polyimide resin according to the present invention includes heating at from 120°C to 350°C a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent comprising at least a compound (A) represented by the general formula (1), in which R 1 represents a hydrogen atom or a hydroxyl group, R 2 and R 3 independently represent a hydrogen atom or a C 1 to C 3 alkyl group, and R 4 and R 5 independently represent a C 1 to C 3 alkyl group. |
申请公布号 |
EP2907838(A1) |
申请公布日期 |
2015.08.19 |
申请号 |
EP20150155578 |
申请日期 |
2015.02.18 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
SHIDA, MASARU;UEMATSU, TERUHIRO;NODA, KUNIHIRO |
分类号 |
C08G73/10 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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地址 |
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