发明名称 揚送研磨装置
摘要 <p><P>PROBLEM TO BE SOLVED: To extend a validity period of a polishing pad, in a pumping polishing device. <P>SOLUTION: The width of a polishing pad is set to be smaller than the width of a rail body and larger than the distance between the outer edges of ball guide grooves at lateral both ends of the rail body. While lateral one end of the polishing pad is aligned with extension of lateral one end of the rail body and the polishing pad is installed in an upper door, D1, D2, and D3 are set such that D2<D1<D3 is satisfied, wherein the distance between the center lines of the ball guide grooves of the rail body is D1; the distance to the center line of the ball guide groove closest to the other end in the width direction of the rail body from the other end in the width direction of the polishing pad is D2; and the distance to the center line of the ball guide groove closest to the lateral one end of the rail body from the lateral one end of the polishing pad is D3. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5767838(B2) 申请公布日期 2015.08.19
申请号 JP20110070612 申请日期 2011.03.28
申请人 发明人
分类号 A63F7/02 主分类号 A63F7/02
代理机构 代理人
主权项
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