发明名称 半導体装置
摘要 <p>The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is formed on or in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.</p>
申请公布号 JP5767366(B2) 申请公布日期 2015.08.19
申请号 JP20140106854 申请日期 2014.05.23
申请人 发明人
分类号 H01L21/8242;C23C14/08;G11C11/405;H01L27/105;H01L27/108;H01L29/786 主分类号 H01L21/8242
代理机构 代理人
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