| 发明名称 |
SUBSTRATE SUPPORT ASSEMBLY HAVING METAL BONDED PROTECTIVE LAYER |
| 摘要 |
A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article. |
| 申请公布号 |
KR20150094685(A) |
申请公布日期 |
2015.08.19 |
| 申请号 |
KR20157018145 |
申请日期 |
2013.12.10 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
PARKHE VIJAY D.;NARENDRNATH KADTHALA RAMAYA |
| 分类号 |
H01L21/683;H01J37/32;H01L21/67 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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