| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain both temporary crimping properties and repair properties in a method for manufacturing a mounting body for mounting an electronic member on a wiring board through an anisotropic conductive film. <P>SOLUTION: The anisotropic conductive film 2, after it is temporarily crimped to a wiring board 1, is properly crimped with electronic components 3 arranged. The temporary crimping is carried out by being pressed at a temperature where the anisotropic conductive film 2 is not thermally hardened. The anisotropic conductive film 2 is to contain thermosetting resin components, thermoplastic resin components, rubber-based polymer components, and conductive particles, and that, the thermoplastic resin components contain low-glass-transition temperature thermoplastic resins with a glass transition temperature lower than a heating temperature at heating in the temporary crimping process, and high-glass-transition temperature thermoplastic resins with a glass transition temperature higher than a heating temperature at heating in the temporary crimping process. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
