发明名称 THERMAL EXPANSION RESIN COMPOSITION
摘要 [Problem] To provide a thermally expandable resin composition which gives molded bodies having excellent fire resistance, stress at break, and relatively low elastic modulus. [Solution] This thermally expandable resin composition contains an epoxy resin, a thermally expandable graphite, and an inorganic filler. Said epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of said bisphenol-type epoxy compound to said aliphatic epoxy compound is in the range 95:5-60:40. This thermally expandable resin composition can be applied in refractory coating materials for pillars, beams and walls, etc., in fireproof sashes, in fireproof compartment passage structures, in fireproof doors, etc.
申请公布号 EP2907847(A1) 申请公布日期 2015.08.19
申请号 EP20130845981 申请日期 2013.10.10
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 YOSHITAKE, TOSHITAKA;TONO, MASAKI;OTSUKA, KENJI;YANO, HIDEAKI
分类号 C08L63/00;C08G59/20;C08K3/00;C08K3/04 主分类号 C08L63/00
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