发明名称 |
DEVICES, SYSTEMS, AND METHODS RELATED TO FORMING THROUGH-SUBSTRATE VIAS WITH SACRIFICIAL PLUGS |
摘要 |
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming one or more openings in a front side of the semiconductor device and forming sacrificial plugs in the openings that partially fill the openings. The method further includes further filling the partially filled openings with a conductive material, where individual sacrificial plugs are generally between the conductive material and a substrate of the semiconductor device. The sacrificial plugs are exposed at a backside of the semiconductor device. Contact regions can be formed at the backside by removing the sacrificial plugs. |
申请公布号 |
EP2907160(A1) |
申请公布日期 |
2015.08.19 |
申请号 |
EP20130847701 |
申请日期 |
2013.10.15 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
PAREKH, KUNAL, R.;KIRBY, KYLE, K. |
分类号 |
H01L23/48;H01L21/768;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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